Senior Optoelectronics Packaging Engineer

Cambridge, MA · Job # 8101BK

Job Description:

  • Design optical coupling interfaces for silicon photonics packaging platform focused on coupling of optical fiber and sources to silicon waveguide structures.


  • Design of optical packaging system for single mode optical fiber coupling to silicon photonic waveguide structures
  • Design of optical packaging system for source coupling to silicon photonic waveguide structures
  • Evaluation of design for reliability, manufacturing, and assembly
  • Hands-on experience in construction and evaluation of optical coupling devices, including fixture design
  • Interface with suppliers in support of specification, quoting, fabrication and evaluation of the components
  • Assist with the documentation (drawings) for product components, including models, production drawings, inspection criteria, etc.
  • Incoming inspection of first article parts to evaluation supplier compliance to the drawing & quality
  • Interact with cross-functional team, including manufacturing, supply line and marketing organizations
  • Some travel (<10%) will be required, including some international travel


  • MS or PhD in mechanical engineering, physics, optics, materials science or related discipline required
  • Minimum of 5 years of related experience in area of optical components and fiber optics, preferably in silicon photonics Software Solidworks required, Zemax or FEA experience desired
  • Expertise in design of opto-mechanical products with sub-micron tolerances, having previously transferred designs to manufacture
  • Lab experience with optical measurements and optical test equipment desired
  • Self-motivated team player with strong communication skills


  • Create packaging designs that provide optimum configurations of competing requirements: thermal, mechanical, electrical, and optical
  • Thermal and mechanical stress modeling
  • Collaborate with Rockley’s device designers and process engineers, as well as external suppliers and CM’s, to provide designs and manufacturing processes optimized for cost, reliability and throughput
  • Define component specifications and locate and develop suppliers
  • Prove the feasibility of the package design and the assembly process by designing experiments, and overseeing prototype build and reliability and stress testing
  • Support pilot production builds
  • Manage the transfer of product packaging to manufacturing at CM's and OSAT's
  • Analyze yield and throughput data for early production and drive improvements in the design and process


  • Thermal and mechanical modeling of optical and/or electronics packages
  • Demonstrated strength in material selection
  • Successful transfer to manufacturing of photonics package designs and processes
  • Working knowledge of die handling and bonding equipment, methods, and materials (wire bonding, flip chip, solder, epoxy, etc.)

Educational Requirements:

  • MSc or PhD in related field or
  • BSc and 3 years’ experience in related field
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